Solder bump interconnection formed using spaced solder deposit a

Details Solder bump interconnection formed using spaced solder deposit a Solder bump interconnection formed using spaced solder deposit a

1992-12-29

1994-02-01

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228215, 2282485, H05K 334

Patent

active

052825655

ABSTRACT:
A solder bump interconnection (34) bonding a metal bump (30) affixed to an integrated circuit component (10) to a terminal pad (18) of a printed circuit board (12) is formed using a consumable path (24) and a solder deposit (28) applied to the path spaced part from the terminal pad. In addition to the terminal pad, the printed circuit board includes a solder-nonwettable surface (21). The consumable path extends from the terminal pad on the solder-nonwettable surface and is formed oa solder-soluble metal. The solder deposit is heated, preferably by a laser beam, to form molten solder that is drawn along the pathdissolving the path as it proceeds. At the terminalmolten solder wets the pad and the metal bump and solidifies to complete the inerconnection.

REFERENCES:
patent: 4914814 (1990-04-01), Behun et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5172852 (1992-12-01), Bernardoni et al.
patent: 5180097 (1993-01-01), Zenshi

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