Solder pads and method of making a solder pad

Details Solder pads and method of making a solder pad Solder pads and method of making a solder pad

2005-06-07

2005-06-07

Stoner, Kiley (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S215000, C228S254000, C438S612000, C438S615000

Reexamination Certificate

active

06902098

ABSTRACT:
A device including a first solder pad and a second solder pad comprised of a post-soldering alloy composition on a substrate is provided. The alloy composition comprises two or more elements, and the post soldering alloy composition of the first solder pad has different amounts of the two or more elements than the alloy composition of the second solder pad. A method of making a solder pad comprises masking a substrate comprising at least a first solder pad and a second solder pad, wherein the mask exposes a greater area of the first solder pad so that the deposited element becomes part of an alloy composition of the first solder pad upon soldering thereby changing the melting point of the first solder pad.

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Translation of JP-407263491A.
Translation of JP-406112463A.

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