Solder standoffs for injection molding of solder

Details Solder standoffs for injection molding of solder Solder standoffs for injection molding of solder

2008-07-02

2010-10-12

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S225000, C228S245000, C438S006000, C438S108000, C438S613000

Reexamination Certificate

active

07810702

ABSTRACT:
A method of producing standoffs in an injection molded solder (IMS) mold, which possesses cavities, each of which is filled with a solder paste using standard techniques, such as screening or IMS. This solder paste is heated to a reflow temperature at which the solder melts and forms a ball or sphere. Since solder pastes are known to reduce in volume due to the therein contained organic material burning off, the remaining solder ball will be significantly lower in volume than that of the cavity. A solder material having a lower melting point is then filled into the cavities about the solder balls. The mold and solder metal are then allowed to cool, resulting in the formation of a solid sphere of metal in the cavity surrounded by solder material of a lower melting point, which, upon transfer to a wafer, form the standoffs.

REFERENCES:
patent: 5244143 (1993-09-01), Ference et al.
patent: 6184062 (2001-02-01), Brofman et al.
patent: 6316291 (2001-11-01), Weber
patent: 6559527 (2003-05-01), Brofman et al.
patent: 6832747 (2004-12-01), Cordes et al.
patent: 2006/0035454 (2006-02-01), Belanger et al.

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