Solder protective coating and fluxless joining of flip chip...

Details Solder protective coating and fluxless joining of flip chip... Solder protective coating and fluxless joining of flip chip...

2005-07-26

2005-07-26

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S214000

Reexamination Certificate

active

06921015

ABSTRACT:
A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.

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