Solder bump transfer device for flip chip integrated circuit dev

Details Solder bump transfer device for flip chip integrated circuit dev Solder bump transfer device for flip chip integrated circuit dev

1995-04-24

1997-03-04

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

437183, H01L 2144

Patent

active

056070993

ABSTRACT:
A carrier device (10) is provided for transferring solder bumps (16) to a surface of a flip chip integrated circuit device (18). The carrier device (10) is equipped with cavities (12) on its surface for receiving and retaining solder material (14), by which the solder material (14) can be transferred to the flip chip (18) as molten solder bumps (16). The cavities (12) are located on the surface of the carrier device (10) such that the location of the solder material (14) will correspond to the desired solder bump locations on the flip chip (18) when the carrier device (10) is registered with the flip chip (18). The size of the cavities (12) can be controlled in order to deliver a precise quantity of solder material (14) to the flip chip (18).

REFERENCES:
patent: 4733823 (1988-03-01), Waggener et al.
patent: 5118584 (1992-06-01), Evans et al.
patent: 5219117 (1993-06-01), Lin
patent: 5220200 (1993-06-01), Blanton
patent: 5261593 (1993-11-01), Casson et al.

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