Solder process for enhancing reliability of multilayer hybrid ci

Metal fusion bonding – Process – Plural joints

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228254, 29846, 427 96, H05K 334

Patent

active

058033432

ABSTRACT:
A thick film hybrid multilayer circuit characterized by circuit components that are electrically interconnected with a multilayer structure composed of multiple layers of conductors interlaid with layers of a dielectric material in order to achieve high component density. The circuit components of the hybrid circuit are bonded to the multilayer structure with a novel soldering technique employing multiple solder compositions, which reduces the occurrence of dielectric fatigue cracking from thermal cycling. As a result, the multilayer structure exhibits significantly enhanced thermal fatigue resistance.

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