Metal fusion bonding – Process – Plural joints
Patent
1995-10-30
1998-09-08
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228254, 29846, 427 96, H05K 334
Patent
active
058033432
ABSTRACT:
A thick film hybrid multilayer circuit characterized by circuit components that are electrically interconnected with a multilayer structure composed of multiple layers of conductors interlaid with layers of a dielectric material in order to achieve high component density. The circuit components of the hybrid circuit are bonded to the multilayer structure with a novel soldering technique employing multiple solder compositions, which reduces the occurrence of dielectric fatigue cracking from thermal cycling. As a result, the multilayer structure exhibits significantly enhanced thermal fatigue resistance.
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Needes Christopher Roderick
Orem James Catlin
Paszkiet Christine Ann
Rama Sarma Dwadasi Hare
Delco Electronics Corp.
Heinrich Samuel M.
Navarre Mark A.
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