Package to semiconductor chip active interconnect site method
Packaging electrical circuits
Packaging for multi-processor shared-memory system
Packaging method using lead-free solder
Pad grid array for receiving a solder bumped chip carrier
Pad-on-via assembly technique
Padless substrate for surface mounted components
Parts assembling method
Passive alignment of components with micromachined tool
Passive and active heat retention device for solder fountain...
Paste providing method, soldering method and apparatus and...
Pb-In-Sn tall C-4 for fatigue enhancement
Piezoelectric element, manufacturing method thereof, and...
Pillar connections for semiconductor chips and method of...
Pin standing resin-made substrate, method of making pin...
Pinhole disk laminate and a process for producing the same
Pipe connection and method
Pivotal wire bonding stage and method of use
Plated compliant lead
Plated-through interconnect solder thief