Solder preforms in a cast array

Metal fusion bonding – Process – Plural joints

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228255, 228 563, B23K 100, B23K 300, B23K 3502

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active

050297481

ABSTRACT:
Cast solder preforms, rings or donuts suitable for use in a reflow solder process to interconnect through-hole pins in an electrical connector to plated through holes in a printed circuit board are disclosed. A plurality of solder donuts are cast into an array so that the plurality of donuts are initially formed as a single unit. The donuts can be either cast onto pins in a connector or cast onto a separate carrier for subsequent insertion onto the pins in a connector.

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Alloys Unlimited Inc., "A Guide to Preform Soldering", Tin Research Institute, Cleveland, Ohio, 1959.

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