Metal fusion bonding – Process – Plural joints
Patent
1989-03-15
1991-07-09
Heinrich, Sam
Metal fusion bonding
Process
Plural joints
228255, 228 563, B23K 100, B23K 300, B23K 3502
Patent
active
050297481
ABSTRACT:
Cast solder preforms, rings or donuts suitable for use in a reflow solder process to interconnect through-hole pins in an electrical connector to plated through holes in a printed circuit board are disclosed. A plurality of solder donuts are cast into an array so that the plurality of donuts are initially formed as a single unit. The donuts can be either cast onto pins in a connector or cast onto a separate carrier for subsequent insertion onto the pins in a connector.
REFERENCES:
patent: 2838593 (1958-06-01), Scesa et al.
patent: 3002481 (1961-10-01), Hutters
patent: 3932934 (1976-01-01), Lynch et al.
patent: 4050621 (1977-09-01), Bouley
patent: 4090768 (1978-05-01), Tregoning
patent: 4164064 (1979-08-01), Reavill et al.
patent: 4216350 (1980-08-01), Reid
patent: 4557411 (1985-12-01), Farquharson et al.
patent: 4663815 (1987-05-01), Hartman et al.
patent: 4767344 (1988-08-01), Noschese
patent: 4884335 (1989-12-01), McCoy et al.
patent: 4896816 (1990-01-01), Lascar et al.
Alloys Unlimited Inc., "A Guide to Preform Soldering", Tin Research Institute, Cleveland, Ohio, 1959.
Lauterbach John H.
Ritchie Leon T.
AMP Incorporated
Heinrich Sam
Pitts Robert W.
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