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Package stack via bottom leaded plastic (BLP) packaging

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Package stack via bottom leaded plastic (BLP) packaging

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Package stack via bottom leaded plastic (BLP) packaging

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Package structure and method for reducing bond wire inductance

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Package structure for multichip modules

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Package structure for multichip modules

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Packaged microcircuit and method for assembly thereof

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Packaged microelectronic component assemblies

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Packaged semiconductor device having stress absorbing film

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Packaged semiconductor device having stress absorbing film

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Packaging and interconnection of contact structure

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Packaging and interconnection of contact structure

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Packaging and interconnection of contact structure

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Packaging assembly

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Packaging device and its manufacturing method

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Packaging electrical components having a scallop formed in an ed

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Packaging integrated circuits with adhesive posts

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Packaging microelectromechanical structures

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Packaging of electronic devices

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Packaging structure for semiconductor IC chip

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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