Packaging microelectromechanical structures

Details Packaging microelectromechanical structures Packaging microelectromechanical structures

2005-02-08

2005-02-08

Reichard, Dean A. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C257S704000, C438S456000

Reexamination Certificate

active

06852926

ABSTRACT:
A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.

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