Ball grid array semiconductor package with exposed base layer
Balltape structure for tape automated bonding, multilayer packag
Base to a housing for an electrical component
Battery mounting structure for power source section of electroni
Biometric sensor and method for its production
Bladder insert for encapsulant displacement
Bladder insert for encapsulant displacement
Bladder insert for encapsulant displacement
Bonding pad isolation
Bottom lead semiconductor chip package
Box for containing electrical mechanisms
Box for electrical components
Box for encasing an electrical device
Box for transmission line repeaters
Box-shaped electric part-mounting construction
Branching connection box for electrical circuits
Brazed leaded package
Build-up structures with multi-angle vias for chip to chip...
Built-in unit for a transmission control of a motor vehicle
Bump chip lead frame and package