Packaging integrated circuits with adhesive posts

Details Packaging integrated circuits with adhesive posts Packaging integrated circuits with adhesive posts

2006-08-22

2006-08-22

Reichard, Dean A. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C257S704000, C257S713000

Reexamination Certificate

active

07094966

ABSTRACT:
A package for an integrated circuit that is attached to a rigid substrate by the flip-chip method has a heat spreader that is attached to the IC by a thermally conductive, compliant adhesive and that is attached to the package substrate by a set of rigid posts of adhesive, the result of which is that the heat spreader is more closely parallel to the substrate than was the case for a stiffener bonded to the substrate by a thin film extending over a large area.

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EN886-0459, Jul. 1988.

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