Package structure and method for reducing bond wire inductance

Details Package structure and method for reducing bond wire inductance Package structure and method for reducing bond wire inductance

1992-07-22

1994-12-06

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29832, H01L 2302

Patent

active

053713214

ABSTRACT:
A package assembly for an integrated circuit die includes a base having a cavity formed therein for receiving an integrated circuit die. The base has a ground-reference conductor. A number of bonding wires are each connected between respective die-bonding pads on the integrated circuit die and corresponding bonding pads formed on the base. The lid has an electrically conductive layer formed on it to cover the integrated circuit die in the cavity formed in the base. The electrically conductive layer formed on the lid is positioned in close proximity to some of the plurality of bonding wires. The electrically conductive layer formed on the lid is connected to the ground-reference conductor of the base. This arrangement reduces both the self-inductances of the one or more conductors and the mutual inductance between the one or more conductors. With this arrangement the electrically conductive layer formed on the lid is grounded to reduce interference being radiated from the electrically conductive layer.

REFERENCES:
patent: 3872583 (1975-03-01), Beall et al.
patent: 4288841 (1981-09-01), Gogal
patent: 4626958 (1986-12-01), Lockard et al.
patent: 4831495 (1989-05-01), Harding

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