Package stack via bottom leaded plastic (BLP) packaging

Details Package stack via bottom leaded plastic (BLP) packaging Package stack via bottom leaded plastic (BLP) packaging

1997-07-09

1999-11-16

Sough, Hyung-Sub

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257686, 257693, H01L 2302

Patent

active

059862092

ABSTRACT:
A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.

REFERENCES:
patent: 5095402 (1992-03-01), Hernandez et al.
patent: 5200364 (1993-04-01), Loh
patent: 5214845 (1993-06-01), King et al.
patent: 5331235 (1994-07-01), Chun
patent: 5418189 (1995-05-01), Heinen
patent: 5466887 (1995-11-01), Hasegawa
patent: 5471369 (1995-11-01), Honda et al.
patent: 5475259 (1995-12-01), Kasai et al.
patent: 5483024 (1996-01-01), Russell et al.
patent: 5486720 (1996-01-01), Kierse
patent: 5493153 (1996-02-01), Arikawa et al.
patent: 5498902 (1996-03-01), Hara
patent: 5508565 (1996-04-01), Hatakeyama et al.
patent: 5527743 (1996-06-01), Variot
patent: 5530286 (1996-06-01), Murakami et al.
patent: 5530292 (1996-06-01), Waki et al.
patent: 5535509 (1996-07-01), Tomita et al.
patent: 5554823 (1996-09-01), Hasegawa
patent: 5554886 (1996-09-01), Song
patent: 5570272 (1996-10-01), Variot
patent: 5572068 (1996-11-01), Chun
patent: 5679978 (1997-10-01), Kawahara et al.
Samsung DRAM Web Page, High Density DRAMs, 2 pages.

Affiliated with

Also associated with

Rating

Package stack via bottom leaded plastic (BLP) packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package stack via bottom leaded plastic (BLP) packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package stack via bottom leaded plastic (BLP) packaging will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1327271