Packaging structure for semiconductor IC chip

Details Packaging structure for semiconductor IC chip Packaging structure for semiconductor IC chip

1978-11-20

1981-04-14

Reynolds, B. A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H05K 506

Patent

active

042621658

ABSTRACT:
A packaging structure for a semiconductor IC chip, in which lead electrodes connected with the chip are extended out through a binding agent filled in a sealing gap, characterized in that in the vicinity of the lead electrodes the outer surface of the binding agent is recessed with respect to the outer surface of the packaging or sealing members.

REFERENCES:
patent: 3059158 (1962-10-01), Doucette et al.
patent: 3308525 (1967-03-01), Tsuji et al.
patent: 3684818 (1972-08-01), Netherwood
patent: 3726006 (1973-04-01), Muckelroy
patent: 3781976 (1974-01-01), Tomiwa
patent: 3885860 (1975-05-01), Sorkin

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