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Ultrahigh-frequency electronic component

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Underfill coating for LOC package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Underfill coating for LOC package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Underfill coating for loc package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Underfill coating for LOC package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Underfill coating for LOC package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Underfill for maximum flip chip package reliability

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Unitary die-cast assembly for electronic circuits

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Universal modular housing system

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Universal semiconductor chip package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Universal semiconductor chip package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Universal surface mount package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Universal surface mount package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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