Packaged microcircuit and method for assembly thereof

Details Packaged microcircuit and method for assembly thereof Packaged microcircuit and method for assembly thereof

1978-01-16

1979-02-13

Truhe, J. V.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29589, 357 74, H05K 506

Patent

active

041397266

ABSTRACT:
A packaged microcircuit includes a housing of insulating material having a plurality of apertures which extend from the interior of the housing to the outside. A metallized lead connection surface is formed on a wall of each aperture. A microcircuit having a plurality of terminals is disposed in the interior of the housing with each of its terminals aligned with a respective aperture. The individual leads extend into the apertures and are soldered to both the terminals and the housing. The first solder connection electrically connects each lead to the terminal aligned with the aperture and the second solder connection anchors each lead to the metallized surface of the housing to absorb mechanical stress applied to an outwardly extending portion of the lead.

REFERENCES:
patent: 3312771 (1967-04-01), Hessinger et al.
patent: 3320351 (1967-05-01), Glickman
patent: 3469684 (1969-09-01), Keady et al.
patent: 3548076 (1970-12-01), Cooke
patent: 3873890 (1975-03-01), Beckman et al.
patent: 3939558 (1976-02-01), Riley
patent: 4012579 (1977-03-01), Fox et al.
patent: 4012835 (1977-03-01), Wallick

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