Package structure for multichip modules

Details Package structure for multichip modules Package structure for multichip modules

1992-06-24

1993-09-07

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257678, 361829, 361728, H01L 2302

Patent

active

052431452

ABSTRACT:
A package for enclosing and mounting a multichip module to a printed wiring board including a ceramic base with an elevated peripheral ledge constructed of a material, having a coefficient of thermal expansion differing substantially from the coefficient of thermal expansion of the material of a serpentine sidewall mounted to the base, and having a lid mounted to the top of the sidewall. The package includes electrical contacts extending through the ledge for connecting the multichip module to the circuit board. The sidewall is a series of interconnected short segments having acute angles at their interconnection forming a pleated shape.

REFERENCES:
patent: 4991291 (1991-02-01), Koepke et al.

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