Package structure for multichip modules

Details Package structure for multichip modules Package structure for multichip modules

1990-05-14

1991-07-23

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 523, 357 74, H01L 2302, H05K 506

Patent

active

050345680

ABSTRACT:
A package for enclosing and mounting a multichip module in which separate mechanisms are provided for mechanically attaching the package to a circuit board and for electrically connecting the package to the circuit board to which it is attached. The package includes a ceramic base on which the multichip module is supported, a frame-like retaining ring which enables the attachment of the package to the circuit board and a lid for covering the top of the package and sealing it off from environmental influences. The package also includes a set of electrical leads extending from the interior to the exterior of the package for providing multiple separate connections between the multichip module and the circuit board on which it is mounted.

REFERENCES:
patent: 4355463 (1982-10-01), Burns
patent: 4688075 (1987-08-01), Phy
patent: 4744009 (1988-05-01), Grabbe et al.

Affiliated with

Also associated with

Rating

Package structure for multichip modules does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package structure for multichip modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package structure for multichip modules will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-433747