Packaging electrical components having a scallop formed in an ed

Details Packaging electrical components having a scallop formed in an ed Packaging electrical components having a scallop formed in an ed

1994-11-10

1997-07-01

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361736, 361743, 29860, 29878, H05K 500, H05K 114

Patent

active

056441037

ABSTRACT:
A structure includes a baseplate, a circuit board parallel and adjacent to the baseplate, and an electronic component. The circuit board has an edge with a scallop formed in the edge, and the scallop is plated with a conductive material. The electronic component includes a power-dissipating surface and a pad for making electrical connection. The electronic component is mounted with the power-dissipating surface in contact with the baseplate and the pad electrically connected to the conductive material.

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