Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1992-12-23
1996-09-10
Thomas, Laura
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
361763, 361776, H01L 2302
Patent
active
055548237
ABSTRACT:
A tantalum capacitor chip and lead terminals respectively connected to two electrodes of the chip are molded in resin. A portion of the lead terminal, not molded in the resin is bent at a tip side and at a base side. The resin is provided with a structure in which its upper half is longer than its lower half at both sides. The base side portion of the portion not molded in the resin, of each of the lead terminals is curved downward with a predetermined radius of curvature, and an inwardly bent portion is formed on the tip side of the base side curved portion of the protruding portion.
REFERENCES:
patent: 4660127 (1987-04-01), Gunter
patent: 4703393 (1987-10-01), Tamamoto et al.
patent: 4794446 (1988-12-01), Hammo
patent: 4890154 (1989-12-01), Sahauian
patent: 5107324 (1992-04-01), Iwahara et al.
patent: 5177674 (1993-01-01), Sugisaki
patent: 5281852 (1994-01-01), Normington
patent: 5410445 (1995-04-01), Taue
patent: 5475259 (1995-12-01), Kosai et al.
Patent Abstracts of Japan, vol. 13, No. 551, Dec. 8, 1989.
Patent Abstracts of Japan, vol. 13, No. 509, Nov. 15, 1989.
Patent Abstracts of Japan, vol. 9, No. 147, Jun. 21, 1985.
Patent Abstracts of Japan, vol. 12, No. 481, Dec. 15, 1988.
Horgan Christopher
Rohm & Co., Ltd.
Thomas Laura
LandOfFree
Packaging device and its manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaging device and its manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging device and its manufacturing method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1322373