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Charge coupled device (CCD) semiconductor chip package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Charge coupled device package with glass lid

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Chip card micromodule as a surface-mount device

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Chip carrier

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Chip carrier

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Chip carrier for optical device

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Chip carrier with terminating resistive elements

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Chip component for fastening to a circuit board, comprising an e

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Chip electronic device with a resin housing and manufacturing pr

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Chip housing

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Chip package capacitor cover

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Chip scale package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Chip size package and method of fabricating the same

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Chip size semiconductor package and fabrication method thereof

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Chip stack and method of making same

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Chip-scale semiconductor package of the fan-out type and...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Chip-size package (CSP) using a multi-layer laminated lead frame

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Chip-type electronic devices

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Circuit assembly encapsulated with polybutadiene urethane

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Circuit board for connecting an integrated circuit to a...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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