Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2005-10-11
2005-10-11
Reichard, Dean A. (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C257S690000, C257S778000
Reexamination Certificate
active
06953893
ABSTRACT:
An apparatus for connecting an integrated circuit to a support has a circuit board having a first surface for attaching the integrated circuit and a second surface opposite to the first surface. Recesses are provided in the second surface for receiving at least portions of solder balls for electrically and mechanically connecting the circuit board to the support. Solder pads are formed within the recesses. An IC BGA package making use of such an integrated circuit can be implemented with a reduced height and improved electrical characteristics when compared to existing designs.
REFERENCES:
patent: 5677566 (1997-10-01), King et al.
patent: 6084300 (2000-07-01), Oka
patent: 6246117 (2001-06-01), Ichinose
patent: 6252298 (2001-06-01), Lee et al.
patent: 6469393 (2002-10-01), Oya
patent: 6552427 (2003-04-01), Moden
Infineon - Technologies AG
Oliva Carmelo
Reichard Dean A.
Slater & Matsil L.L.P.
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