Circuit assembly encapsulated with polybutadiene urethane

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437219, 437224, 4284231, 257788, 257687, H01L 2328

Patent

active

051854988

ABSTRACT:
An acceleration sensor is packaged in an open can and encapsulated in an elastomeric polybutadiene compound which maintains its mechanical properties over a range of -40.degree. C. to 105.degree. C. and transmits acceleration to the sensor with a unity transfer function. The encapsulation material comprises about 90 to 100 pbw of polyol and about 20 pbw of isocyanate, the polyol consisting of at least 70% of hydroxy-polybutadiene. For enhanced adhesion a foaming agent and/or an epoxy is added to the mixture.

REFERENCES:
patent: 4871477 (1989-10-01), Dimanshteyn
patent: 5079270 (1992-01-01), Burkhart et al.
patent: 5079275 (1992-01-01), Durvasula et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Circuit assembly encapsulated with polybutadiene urethane does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit assembly encapsulated with polybutadiene urethane, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit assembly encapsulated with polybutadiene urethane will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-326875

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.