Charge coupled device (CCD) semiconductor chip package

Details Charge coupled device (CCD) semiconductor chip package Charge coupled device (CCD) semiconductor chip package

1997-01-17

1998-05-19

Sough, Hyung S.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361820, 257434, 257680, H01L 2302

Patent

active

057538573

ABSTRACT:
A charge coupled device (CCD) semiconductor chip package includes a body having a hole formed in the center thereof and a projection extending inwardly from the inner wall of the body. A plurality of outleads are embedded in the projection, and a plate is attached to the upper surface of the projection. A glass lid is attached to the upper surface of the body for covering the upper portion of the hole. A chip has a light receiving area and a plurality of solder balls, and a bottom cover fills the lower portion of the hole and supports the chip. The CCD package chip employs a direct connection technique of outleads to solder balls formed on chip pads, instead of a wire bonding process, which demands a high temperature environment. By using a price competitive plastic body, material cost is reduced compared to a costly material, such as a ceramic body, when fabricating a semiconductor package. Further, package reliability is enhanced.

REFERENCES:
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 4868638 (1989-09-01), Hirata et al.

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