Chip carrier

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

174 16HS, 357 81, 361388, H05K 720

Patent

active

041478894

ABSTRACT:
An improved chip carrier of thin dieletric deformed into a dish configuration provided with flexible mounting flanges on which are plated or bonded solderable conductive traces and paths together with plated or bonded heat sinks which may be referenced to ground potential, and which provides structural integrity.

REFERENCES:
patent: 3801728 (1974-04-01), Gallo et al.
patent: 3839660 (1974-10-01), Stryker
patent: 3846734 (1974-11-01), Pauza et al.
patent: 3865458 (1975-02-01), Pauza et al.
patent: 3877064 (1975-04-01), Scheingold et al.
patent: 3936928 (1976-02-01), Hopp
patent: 3958195 (1976-05-01), Johnson
patent: 3963315 (1976-06-01), Bonis
patent: 4066839 (1978-01-01), Cossatta et al.

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