Chip package capacitor cover

Details Chip package capacitor cover Chip package capacitor cover

1989-05-08

1991-08-27

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 75, 361306, H01L 2302

Patent

active

050435337

ABSTRACT:
Disclosed is a cover for a semiconductor chip package. The cover comprises a sealing surface for providing a seal between the cover and a semiconductor chip package. A mounting surface for mounting a capacitor to the surface of cover is provided. The mounting surface comprises metalization including a metalized power pad and a metalized ground pad for mounting at least one capacitor on the surface of the cover.

REFERENCES:
patent: 3833753 (1974-09-01), Garboushiam
patent: 4249196 (1981-02-01), Durney et al.
patent: 4451845 (1984-05-01), Philofsky et al.
patent: 4598307 (1986-07-01), Wakabayashi et al.
patent: 4636918 (1987-01-01), Jodoin
patent: 4654694 (1987-03-01), Val
patent: 4672421 (1987-06-01), Lin
patent: 4714952 (1987-12-01), Takekawa et al.

Affiliated with

Also associated with

Rating

Chip package capacitor cover does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip package capacitor cover, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip package capacitor cover will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1415909