Chip electronic device with a resin housing and manufacturing pr

Details Chip electronic device with a resin housing and manufacturing pr Chip electronic device with a resin housing and manufacturing pr

1992-02-25

1993-11-30

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

336 96, 26427211, 2642711, 257787, H01L 2328, B29B 1300

Patent

active

052667391

ABSTRACT:
A chip electronic device wherein an electronic element such as an inductor and capacitor, and terminals are covered with a resin housing. Plated lower surfaces and edges of the terminals show on a bottom and sides of a housing respectively. The lower surfaces of the terminals are soldered onto conductive patterns of a printed wiring board, and fillets of solder are formed at the edges of the terminals.

REFERENCES:
patent: 3550228 (1970-12-01), Asscher
patent: 4064472 (1977-12-01), Gunewardena et al.
patent: 4365284 (1982-12-01), Tanaka
patent: 4490706 (1984-12-01), Satou et al.
patent: 4498067 (1985-02-01), Kumokawa et al.
patent: 4571662 (1986-02-01), Conquest et al.
patent: 4879804 (1989-11-01), Chiang
patent: 4939494 (1990-07-01), Masuda et al.
patent: 5034854 (1991-07-01), Matsumura et al.

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