Rough electrode (high surface area) from Ti and TiN
Roughened bonding pad and bonding wire surfaces for low...
Roughness reducing film at interface, materials for forming...
Routable high-density interfaces for integrated circuit devices
Routing density enhancement for semiconductor BGA packages and p
Routing design to minimize electromigration damage to solder...
Routing differential signal lines in a substrate
Routing driven, metal programmable integrated circuit...
Routing element for use in multi-chip modules, multi-chip...
Routing element for use in multi-chip modules, multi-chip...
Routing element for use in multi-chip modules, multi-chip...
Routing element for use in semiconductor device assemblies
Routing for integrated circuits
Routing for multilayer ceramic substrates to reduce...
Routing method and arrangement for power lines and signal lines
Routing scheme for differential pairs in flip chip substrates
Routing structure for a customizable integrated circuit
Routing vias in a substrate from bypass capacitor pads
RRAM memory cell electrodes
Rugged and fast power MOSFET and IGBT