Routing element for use in multi-chip modules, multi-chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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C257SE23117

Reexamination Certificate

active

07372138

ABSTRACT:
A routing element for use in a semiconductor device assembly includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a carrier substrate of the semiconductor device assembly. The conductive traces may be carried upon a single surface of the routing element substrate, be carried internally by the routing element substrate, or include externally and internally carried portions. The routing element may also include a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multichip module. Multichip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used.

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