Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent
1999-07-01
2000-11-21
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
257773, 257698, H01L 2348, H01L 2352, H01L 2940
Patent
active
061507296
ABSTRACT:
A routing scheme for a multilayer printed wiring board or semiconductor package is disclosed. Each of a first group of electrical contacts such as bond pads is disposed on a first surface and is electrically coupled to one of a plurality of conductive surface connectors such as vias. Each of a second group of electrical contacts is disposed on the first surface and is routed by one of a second plurality of traces. Each of a plurality of short traces couple each of the bond pads in the first group with corresponding ones of the vias, which in turn are electrically coupled to one of a plurality of first traces on the second surface. The orientation between certain electrical contacts in the first group and their associated vias is different than the orientation between certain other electrical contacts in the first group and their associated vias. This varying orientation allows greater routing density on the second surface.
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patent: 5686764 (1997-11-01), Fulcher
patent: 5903051 (1999-05-01), Miks et al.
patent: 6008543 (1999-12-01), Iwabuchhi
Clark Sheila V.
LSI Logic Corporation
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