Routing scheme for differential pairs in flip chip substrates

Details Routing scheme for differential pairs in flip chip substrates Routing scheme for differential pairs in flip chip substrates

2006-09-12

2006-09-12

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S774000, C257S778000, C257S786000

Reexamination Certificate

active

07105926

ABSTRACT:
A flip chip substrate is provided, which includes a plurality of conductive layers, including a top layer and a bottom layer. A first plurality of contacts, including first and second contacts corresponding to a differential signal pair, are arranged on the top layer within a die bonding area. A second plurality of contacts, including third and fourth contacts corresponding to the differential signal pair, are arranged on the bottom layer. First and second traces are routed between the first and third contacts and between the second and fourth contacts, respectively, wherein the second trace is routed out of the die bonding area on a different layer than the first trace. The traces are routed in a manner that reduces the length difference between the traces.

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