Routing design to minimize electromigration damage to solder...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

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Details

C257SE23020, C257SE21508, C257SE23021, C257S774000, C257S773000, C257S680000, C257S758000, C438S612000

Reexamination Certificate

active

11048204

ABSTRACT:
A novel pad structure for an integrated circuit component that utilizes a bump interconnect for connection to other integrated circuit components that produces a relatively uniform current distribution within the bump of the bump interconnect is presented. The pad structure includes an inner pad implemented on an inner conductive layer of the integrated circuit component, an outer pad implemented on an outer conductive layer of the integrated circuit component, and a plurality of vias connecting the inner pad and outer pad. The outer pad is sealed preferably around its edges with a passivation layer, which includes an opening exposing a portion of the outer pad. The vias connecting the inner pad and outer pad are preferably implemented to lie in a via region within the footprint of the pad opening.

REFERENCES:
patent: 5777486 (1998-07-01), Hsu
patent: 6504252 (2003-01-01), Matsunaga
patent: 6521996 (2003-02-01), Seshan
patent: 6825541 (2004-11-01), Huang et al.
patent: 7081405 (2006-07-01), Chien
patent: 2003/0167632 (2003-09-01), Thomas et al.
patent: 2004/0113261 (2004-06-01), Sunohara et al.
patent: 2005/0040527 (2005-02-01), Huang
patent: 2006/0043608 (2006-03-01), Bernier et al.
patent: 2006/0186539 (2006-08-01), Dauksher et al.

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