LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – With means to prevent inspection of or tampering with an...

Tamper resistant packaging and approach

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Tamper resistant packaging with transient liquid phase bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Tamper-resistant semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

TaN integrated circuit (IC) capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Tank-isolated-drain-extended power device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Tantalum - aluminum - nitrogen material for semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Tantalum anodization for in-laid copper metallization capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Tantalum chip capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Tantalum lanthanide oxynitride films

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Tantalum-aluminum-nitrogen material for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Tantalum-aluminum-nitrogen material for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Tantalum-aluminum-nitrogen material for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tap connections for circuits with leakage suppression...

Reissue Patent

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tap connections for circuits with leakage suppression...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape application platform and processes therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape application platform and processes therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape application platform and processes therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Tape attachment chip-on-board assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Tape automated bonded (TAB) circuit