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Chip packaging and connection for reduced EMI

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Chip packaging compositions, packages and systems made...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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Chip packaging structure adapted to reduce electromagnetic...

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
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Chip packaging structure for improving reliability

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Groove
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Chip packaging structure for improving reliability

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Groove
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Chip packaging structure having redistribution layer with...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Chip packaging structure without leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip packaging system and method using deposited diamond film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip packaging technique

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Chip resistor and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
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Chip resistor and method for producing same

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent

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Chip resistor having insulating body with a continuous resistanc

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent

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Chip resistor, process for producing the same, and frame for...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Chip scale ball grid array for integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Chip scale ball grid array for integrated circuit packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Chip scale electrical test fixture with isolation plate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping
Reexamination Certificate

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Chip scale image sensor package

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
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Chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Patent

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Chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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