Chip scale package

Details Chip scale package Chip scale package

1998-09-18

2000-03-14

Loke, Steven H.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Beam leads

257734, 257680, 257669, 257666, 257784, 438461, 438611, 361813, H01L 2348

Patent

active

060376627

ABSTRACT:
A patterned tape attached to a semiconductor chip in a chip scale package enhances process reliability in manufacturing of the chip scale package. A shape of the beam leads concentrates stresses in the part of the beam lead where the beam lead should be disconnected during the bonding of the beam leads to the chip bonding pads, and therefore, the part to be expected to be disconnected disconnects without damaging other parts of the beam lead. In addition, the reliability of a chip scale package is enhanced, because the beam lead attached to the chip bonding pad has little chance of being damaged during bonding.

REFERENCES:
patent: 4109096 (1978-08-01), Dehaine
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5866949 (1999-02-01), Schueller

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