Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2003-10-30
2009-11-03
Fahmy, Wael (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257SE21518, C438S123000, C338S309000, C338S332000
Reexamination Certificate
active
07612429
ABSTRACT:
A chip resistor (A1) comprises a first insulation layer (2A) covering the regions between a plurality of electrodes (3) on a rear surface (10a) of a resistor (1), and a second insulation layer covering a pair of side faces of the resistor (1). Inadvertent adhesion of solder to an improper part of the resistor (1) can thereby be eliminated. A solder layer (4) is preferably formed on a pair of end faces (10d) of the resistor (1). In so doing, a solder fillet can be formed appropriately.
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Miwa Tadatoshi
Tsukada Torayuki
Fahmy Wael
Hamre Schumann Mueller & Larson P.C.
Ingham John C
Rohm & Co., Ltd.
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