Chip resistor, process for producing the same, and frame for...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257SE21518, C438S123000, C338S309000, C338S332000

Reexamination Certificate

active

07612429

ABSTRACT:
A chip resistor (A1) comprises a first insulation layer (2A) covering the regions between a plurality of electrodes (3) on a rear surface (10a) of a resistor (1), and a second insulation layer covering a pair of side faces of the resistor (1). Inadvertent adhesion of solder to an improper part of the resistor (1) can thereby be eliminated. A solder layer (4) is preferably formed on a pair of end faces (10d) of the resistor (1). In so doing, a solder fillet can be formed appropriately.

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patent: 5170146 (1992-12-01), Gardner et al.
patent: 5339068 (1994-08-01), Tsunoda et al.
patent: 5450055 (1995-09-01), Doi
patent: 6777778 (2004-08-01), Sato
patent: 6955942 (2005-10-01), Kobayashi et al.
patent: 0326212 (1989-01-01), None
patent: 47-27876 (1972-08-01), None
patent: 50-128657 (1975-10-01), None
patent: 7-29704 (1995-01-01), None
patent: 10-135013 (1998-05-01), None
patent: 2002-57009 (2002-02-01), None
patent: 2002-208502 (2002-07-01), None

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