LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Wire bond pads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Wire bond-less electronic component for use with an external...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Wire bondable package design with maxium electrical performance

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Wire bonded flip-chip assembly of semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Wire bonded semiconductor device having low inductance and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Wire bonded wafer level cavity package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Wire bonding CU interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Wire bonding device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Wire bonding for thin semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Wire bonding method and apparatus and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Wire bonding method and apparatus for integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Wire bonding method and apparatus for integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Wire bonding method and related device for high-frequency...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Wire bonding method and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Wire bonding method and semiconductor package manufactured...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Wire bonding method, semiconductor device, circuit board,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Wire bonding method, wire bonding apparatus and semiconductor de

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Wire bonding on thinned portions of a lead-frame configured...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Wire bonding package