Wire bonding package

Details Wire bonding package Wire bonding package

2006-06-20

2006-06-20

Owens, Douglas W. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S784000, C257S697000

Reexamination Certificate

active

07064421

ABSTRACT:
A wire bonding package has a housing having a plurality of pins, a circuit board installed inside the housing and having at least a trace connected to a pin of the housing, at least a die installed on the circuit board and having a plurality of bonding pads, and at least a bonding line connected between a bonding pad of the die and the trace of the circuit board so that the bonding pad of the die is electrically connected to the pin of the housing.

REFERENCES:
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 6121686 (2000-09-01), Togawa
patent: 6281572 (2001-08-01), Robbins
patent: 6417532 (2002-07-01), Tsunoda et al.
patent: 6744126 (2004-06-01), Chiang
patent: 2002/0100967 (2002-08-01), Gaku et al.
patent: 2003/0151133 (2003-08-01), Kinayman et al.
patent: 2003/0162319 (2003-08-01), Crane et al.
patent: 2004/0118587 (2004-06-01), Gilliland
patent: 2004/0120128 (2004-06-01), Chang

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