Wire bonding method and semiconductor device

Details Wire bonding method and semiconductor device Wire bonding method and semiconductor device

2007-10-23

2007-10-23

Hu, Shouxiang (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257S784000

Reexamination Certificate

active

11063866

ABSTRACT:
A wire bonding method for bonding a plurality of conducting wires to connect first conductors and second conductors has the following steps. 1) Bonding a first conducting ball on a first first conductor. 2) Bonding a first conducting wire on the first conducting ball, the first conducting wire being connected to a first second conductor. 3) Bonding a second conducting ball on a second first conductor. 4) Bonding a second conducting wire on the second conducting ball, the second conducting wire being connected to a second second conductor. Here, the second first conductor or the second second conductor is the first conducting wire bonded on the first conducting ball.

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First Office Action from Chinese Patent Office issued on Dec. 8, 2006 for the corresponding Chinese patent application No. 200510054299.X (a copy and English translation thereof).

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