Wire bond pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S734000, C257S774000, C257S776000, C257S779000, C257S784000, C257S786000, C257SE23019, C257SE23020, C257SE23142, C257SE23143

Reexamination Certificate

active

07843069

ABSTRACT:
A wire bond pad and method of fabricating the wire bond pad. The method including: providing a substrate; forming an electrically conductive layer on a top surface of the substrate; patterning the conductive layer into a plurality of wire bond pads spaced apart; and forming a protective dielectric layer on the top surface of the substrate in spaces between adjacent wire bond pads, top surfaces of the dielectric layer in the spaces coplanar with coplanar top surfaces of the wire bond pads.

REFERENCES:
patent: 5302551 (1994-04-01), Iranmanesh et al.
patent: 5366848 (1994-11-01), Thane et al.
patent: 5404047 (1995-04-01), Rostoker et al.
patent: 5677239 (1997-10-01), Isobe
patent: 5785236 (1998-07-01), Cheung et al.
patent: 5844317 (1998-12-01), Bertolet et al.
patent: 5989992 (1999-11-01), Yabu et al.
patent: 6054389 (2000-04-01), Cheng
patent: 6500750 (2002-12-01), Shroff et al.
patent: 6521530 (2003-02-01), Peters et al.
patent: 6566757 (2003-05-01), Banerjee et al.
patent: 6580168 (2003-06-01), Shen et al.
patent: 6746898 (2004-06-01), Lin et al.
patent: 6952051 (2005-10-01), Sandhu et al.
patent: RE39932 (2007-12-01), Yabu et al.
patent: 2002/0064929 (2002-05-01), Bohr
patent: 2004/0121577 (2004-06-01), Yu et al.
patent: 2005/0048755 (2005-03-01), Roche et al.
patent: 2006/0065969 (2006-03-01), Antol et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wire bond pads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire bond pads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bond pads will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4196542

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.