Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1998-06-04
1999-04-27
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
267798, H01L 23495
Patent
active
058982140
ABSTRACT:
A wire bonding device effects a bonding technique using ultrasonic waves to connect a chip having a semiconductor element and inner lead portions of a leadframe together by using metal fine wires. Herein, the wire bonding device employs a general-use leadframe, which is constructed in such a way that an angle of 0.degree. or 90.degree. is formed between the inner lead portions and frame. A frame guide is provided to transport the leadframes, which are placed at prescribed positions at a wire bonding mode. A bonding tool applies ultrasonic waves to connect the chip and the inner lead portions of the leadframe together by using the metal fine wires. An ultrasonic wave transmission arm holds the bonding tool at a tip portion thereof. The arm is capable of moving close to or apart from the leadframes, wherein a prescribed angle (e.g., 45.degree.) is kept between moving directions of the arm and longitudinal directions of all of the inner lead portions of the leadframes. A bonding head, which is mounted on a bonding stage, supports the arm to have a capability of free movement while keeping the prescribed angle with respect to the inner lead portions. The bonding stage is capable of moving in axial directions thereof when being driven. Thus, the wire bonding device is capable of reducing the dispersion in applying directions of the ultrasonic waves with respect to the chips and the inner lead portions of the leadframes.
REFERENCES:
patent: 5801432 (1998-09-01), Rostoker et al.
patent: 5808354 (1998-09-01), Lee et al.
Jr. Carl Whitehead
NEC Corporation
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