Wire bonding method and apparatus for integrated circuit

Details Wire bonding method and apparatus for integrated circuit Wire bonding method and apparatus for integrated circuit

2007-11-20

2007-11-20

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23070, C438S125000

Reexamination Certificate

active

11177700

ABSTRACT:
Wire bonding methods and apparatuses are described herein. In one aspect of the invention, an exemplary apparatus includes a plurality of electrically conductive contacts disposed on a surface of the IC device, the plurality of electrically conductive contacts being disposed in at least two rows, a plurality of first return paths formed through some of the plurality of electrically conductive contacts, a plurality of signal paths formed through some of the plurality of electrically conductive contacts, and wherein at least one of the plurality of first return paths are placed between every predetermined number of the plurality of the signal-paths. Other methods and apparatuses are also described.

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