Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate
2007-08-21
2007-08-21
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For high frequency device
C257SE23037, C257SE23043
Reexamination Certificate
active
10871218
ABSTRACT:
Aspects of the invention recite wire bonding on thinned portions of a lead-frame that is configured for use in an IC package. A harder lead-frame material, improved adhesive tape, and various structural features of the lead-frame itself, in various combinations or subcombinations, facilitate the attachment of wire bonds to thinned areas of the lead-frame. This eliminates the need for supports placed directly under the bond sites, removing unwanted conductive areas on the outer surface of an IC package.
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Bayan Jamie A.
Nadarajah Santhiran S O
Prabhu Ashok S.
Ramley Hasfiza
Yeen Chan Peng
Beyer & Weaver, LLP
Ingham John C.
National Semiconductor Corporation
Weiss Howard
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