Wire bonding on thinned portions of a lead-frame configured...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Reexamination Certificate

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C257SE23037, C257SE23043

Reexamination Certificate

active

10871218

ABSTRACT:
Aspects of the invention recite wire bonding on thinned portions of a lead-frame that is configured for use in an IC package. A harder lead-frame material, improved adhesive tape, and various structural features of the lead-frame itself, in various combinations or subcombinations, facilitate the attachment of wire bonds to thinned areas of the lead-frame. This eliminates the need for supports placed directly under the bond sites, removing unwanted conductive areas on the outer surface of an IC package.

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