Wire bonding method and related device for high-frequency...

Details Wire bonding method and related device for high-frequency... Wire bonding method and related device for high-frequency...

2007-03-12

2010-02-23

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257SE23080, C438S617000

Reexamination Certificate

active

07667321

ABSTRACT:
A wire bond circuit device has a circuit die in which substantially all of the input/output (I/O) pads are disposed along the outermost row of pads. A substrate onto which the die is disposed has wedges that are similarly arranged in rows, with the wedges used to carry I/O placed closest to the circuit die. As a result, lowest-tiered bond wire is used to connect the I/O-related pads to their respective wedges.

REFERENCES:
patent: 6031216 (2000-02-01), Singh et al.
patent: 7030490 (2006-04-01), Lee
patent: 2005/0245062 (2005-11-01), Kingsbury et al.
patent: 2005/0275089 (2005-12-01), Joshi et al.
patent: 2006/0180916 (2006-08-01), Wyland
patent: 2006/0192300 (2006-08-01), Appel et al.
patent: WO0120669(A2) (2001-03-01), None
patent: WO0120669(A3) (2001-03-01), None
patent: WO2006090196(A1) (2006-08-01), None
Dennis Yee et al., “A 2-GHz Low-Power Single-Chip CMOS Receiver for WCDMA Applications”, Dec. 31, 2000.

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