LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Underfill of a bumped or raised die utilizing a barrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Underfill of a bumped or raised die utilizing a barrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Underfill of a bumped or raised die utilizing barrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Underfill of bumped or raised die using a barrier adjacent to th

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Underfill of chip-under-chip semiconductor modules

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Underfilled, encapsulated semiconductor die assemblies and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Underfilling process in a molded matrix array package using...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Underfilling process in a molded matrix array package using...

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding

Underlayer for high performance magnetic tunneling junction...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Underside heat slug for ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Underside heat slug for ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Undoped oxide liner/BPSG for improved data retention

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Undoped polysilicon as the floating-gate of a split-gate...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Undoped polysilicon gate process for NMOS ESD protection circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Unerasable electronic programmable read only memory (UPROM.TM.)

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding

Unerasable programmable read-only memory

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Uni-directional flash device

Active solid-state devices (e.g. – transistors – solid-state diode – With specified impurity concentration gradient – With high resistivity

Uni-directional PIN or NIP conducting low capacitance...

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Unidirectionally conductive materials for interconnection