Underfilling process in a molded matrix array package using...

Details Underfilling process in a molded matrix array package using... Underfilling process in a molded matrix array package using...

2008-03-04

2008-03-04

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S575000, C257S930000, C257S789000, C361S783000

Reexamination Certificate

active

10287318

ABSTRACT:
Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom of other substrates (e.g., dice) coupled to the package substrate. By separating the top flow front and the bottom flow front, this process prevents the top flow front from wrapping around the sides of the substrates and trapping air below each substrate and in front of the bottom flow front.

REFERENCES:
patent: 5854507 (1998-12-01), Miremadi et al.
patent: 5883426 (1999-03-01), Tokuno et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6121682 (2000-09-01), Kim
patent: 6324069 (2001-11-01), Weber
patent: 6563712 (2003-05-01), Akram et al.
patent: 6580169 (2003-06-01), Sakuyama et al.

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