Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1997-08-11
1999-10-26
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257738, 257779, 257783, 438118, 438120, 438126, H01L 2348, H01L 2144
Patent
active
059734043
ABSTRACT:
A method and apparatus for attaching a semiconductor device to a substrate. One end of the substrate is elevated to position the substrate and the coupled semiconductor device on an inclined plane. An underfill material is introduced along a wall of the semiconductor device located at the elevated end of the inclined substrate with the underfill material being placed between the substrate and the semiconductor device. An optional but preferred additional step of the invention includes coupling a barrier means to the substrate at a point on the substrate adjacent to a sidewall of the semiconductor device located at the lowest point of the slope created by the inclined substrate. The barrier means prevents the underfill material from spreading beyond the sidewalls of the semiconductor device, particularly in instances where the substrate is inclined at a steep angle.
REFERENCES:
patent: 5203076 (1993-04-01), Banerji et al.
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5239447 (1993-08-01), Cotues et al.
patent: 5258648 (1993-11-01), Lin
patent: 5289346 (1994-02-01), Carey et al.
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5385869 (1995-01-01), Liu et al.
patent: 5403439 (1995-04-01), Matthews
patent: 5410181 (1995-04-01), Zollo et al.
patent: 5436503 (1995-07-01), Kunitomo et al.
patent: 5438219 (1995-08-01), Kotzan et al.
patent: 5439162 (1995-08-01), George et al.
patent: 5442240 (1995-08-01), Mukerji
patent: 5450283 (1995-09-01), Lin et al.
patent: 5468995 (1995-11-01), Higgins, III
patent: 5498576 (1996-03-01), Hotchkiss et al.
patent: 5532187 (1996-07-01), Schreiber-Prillwitz et al.
patent: 5590462 (1997-01-01), Hundt et al.
patent: 5697148 (1997-12-01), Lance, Jr. et al.
Akram Salman
Wark James M.
Chambliss Alonzo
Chaudhuri Olik
Micro)n Technology, Inc.
LandOfFree
Underfill of bumped or raised die using a barrier adjacent to th does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Underfill of bumped or raised die using a barrier adjacent to th, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Underfill of bumped or raised die using a barrier adjacent to th will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-768001