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Multiphase synchronous buck converter

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Multiple active layer integrated circuit and a method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Multiple active layer structure and a method of making such...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Multiple array linear CCD imager

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device
Patent

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Multiple bit chalcogenide storage device

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material
Reexamination Certificate

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Multiple bit chalcogenide storage device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Multiple cavity/compartment package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Multiple cell with common bit line contact and method of manufac

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent

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Multiple channel high electron mobility transistor

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor
Patent

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Multiple chip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Multiple chip guard rings for integrated circuit and chip...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to increase breakdown voltage threshold – In integrated circuit
Reexamination Certificate

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Multiple chip hybrid package using bump technology

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Multiple chip module apparatus having dual sided substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Multiple chip module configuration to simplify testing process a

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Multiple chip package and IC chips

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Multiple chip package and IC chips

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Multiple chip package semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Multiple chip semiconductor arrangement having electrical...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate

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Multiple chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Multiple chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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