Multiple cavity/compartment package

Details Multiple cavity/compartment package Multiple cavity/compartment package

2006-09-05

2006-09-05

Prenty, Mark V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S724000

Reexamination Certificate

active

07102220

ABSTRACT:
A package assembly for electronic components that allows for low-cost multiple cavities as well as a multiple compartment structure that allows more components in a smaller package size. In one embodiment the present invention is a multi-cavity package having at least one substrate forming at least one cavity with the substrate coupled to a shelf within the sidewalls of the package.

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